Technology Evolution | Hitachi Energy 4500V StakPak IGBT: Ushering in a New Era of Power Electronics

On the path of power electronics development pursuing higher voltage and higher current, the birth of the Hitachi Energy StakPak 4500V/3000A IGBT module marks a new stage for press-pack IGBT technology. Today, let's delve into the technological development path and future application potential of this innovative product.
                                   

I. The Path of Technological Development: Comprehensive Breakthrough from Chip to System
     1. Chip Technology Upgrade

• Utilizes SPT+ (Soft Punch Through) chip technology, achieving softer switching characteristics.
• Possesses high turn-off robustness, maintaining stable performance under extreme operating conditions.
• Desaturation current reaches 15,000A, providing sufficient margin for overcurrent protection.

     2. Revolutionary Packaging Innovation

• Patented press-pack structure: Each chip bears pressure independently, eliminating solder fatigue.
• Spring pressure system: Ensures uniform contact, reducing on-state resistance.
• Explosion-proof housing design: Supports short-circuit currents up to 1MA, comprehensively enhancing safety levels.

     3. Leapfrog Performance Enhancement

• Jumps from the traditional 1200A rating to 3000A continuous current.
• 6000A overcurrent turn-off capability, eliminating the need for complex paralleling.
• Supports 15kA soft shutdown, breaking through traditional SOA limits.

II. Unlimited Application Potential: From Current Projects to the Future Grid
     1. Current Mature Application Area: VSC-HVDC Flexible DC Transmission

• Single module output current reaches 2700Arms.
• Can support 3GW-level transmission projects, avoiding the complexity of multi-module paralleling.
• Reliability has been verified in 20 actual projects.

     2. Current Mature Application Area: DC Circuit Breakers

• Successfully turning off 15kA transient current with an interruption time of only 5μs.
• Possesses 5ms overcurrent withstand capability, meeting the stringent requirements of circuit breakers.
• Stable operation even when junction temperature rises from room temperature to 85°C.

     3. Future Expansion Potential: Offshore Wind Power Transmission

• Adapts to harsh environments with high salt fog and high humidity.
• Provides reliable converter solutions for long-distance offshore wind power.

     4. Future Expansion Potential: Grid Interconnection and Energy Internet

• Supports the construction of multi-terminal DC grids.
• Provides the core power conversion platform for the Energy Internet.

     5. Future Expansion Potential: Ultra-High-Capacity Industrial Drives

• Replaces traditional multi-module parallel solutions.
• Simplifies system structure and improves reliability.

III. Outlook on Technology Evolution
      1. Next-Generation Technology Roadmap

• Integration of BIGT (Bimode Insulated Gate Transistor) technology.
• Trench gate cell design, further increasing current density.
• Switching losses reduced by 20-30%, achieving new highs in efficiency.

     2. System-Level Optimization Potential

• Combination with SiC diodes to achieve hybrid switching characteristics.
• Intelligent drive technology for adaptive switching control.
• Digital lifetime prediction for predictive maintenance.

IV. Technical Verification and Endorsement

     1. Simulation Verification

• Temperature rise during 6000A turn-off is only 20-25°C.

     2. Experimental Verification

• 4 modules in series, voltage imbalance <10%.

     3.Project Verification

• 20 HVDC projects, failure rate of 100 FIT.

     4. Lifetime Verification

• 180,000 load cycles, decades of service life
   

The launch of the Hitachi Energy 4500V StakPak IGBT module not only addresses the current technical bottlenecks in high-power applications but also lays a solid foundation for the upgrade and transformation of the future power grid. From chip technology to packaging process, from individual performance to system application, StakPak is leading power semiconductor technology into a brand new era.